- #Agilent 3070 ict test systems upgrade
- #Agilent 3070 ict test systems software
- #Agilent 3070 ict test systems Pc
- #Agilent 3070 ict test systems windows
Highly effective tools to analyze test coverage The boundary-scan products of JTAG Technologies lead the industry in delivering powerful benefits to the designer and test engineer: High degree of automation in testĭevelopment, in-system programming applications and fault diagnosis In thousands of manufacturing facilities around the world, boundary-scan, often in combination with ICT, has been proven to be extremely effective even on the most crowded PCBs. 1149.1, has been widely adopted by leading manufacturers to perform testing and in-system programming of flash memories and PLDs on digital circuit boards. Ethernet-based JTAG Symphony integration for Agilent 3070 ICTsīenefits of boundary-scan testing on high-density boardsBoundary-scan testing, based on the IEEE Std. These trends are causing test professionals to look for effective and budget-minded solutions, often by combining available test techniques in an optimized test strategy for maximum value.įig. ICT misses an increasing percentage of defects, delaying detection and correction until later in the production process, and thereby weakening the effectiveness of process control.Īs a result, more faults must be found in functional testing, requiring highly skilled engineering resources for test development and bone-pile resolution.
As a result, the test coverage on complex boards is decreasing, resulting in several undesirable and costly outcomes: To catch up with the IC device packaging technology, ICT test fixtures are becoming more complex, more expen. For digi tal target boards, fixture-based in-circuit test systems are bumping against their limits in terms of the number of available test nodes, inadequate spacing between test points, and inaccessible nodes underneath ball-grid array packages and within inner board layers. The Impact of High-Density PCB Design on In-Circuit TestingAs electronics designers continue to drive greater densities onto their printed circuit boards, testing for the occurrence of manufacturing faults becomes an increasingly difficult challenge for the test engineers.
#Agilent 3070 ict test systems Pc
Interchangeability of application files between PC and UNIX environ-ments for application development and executionįast flash programming with easy S-record, Intel Hex file and binary updatesĬPLD programming without compiling and debugging numerous PCF routinesĮasy to retrofit to existing fixtures and programs
#Agilent 3070 ict test systems windows
JTAG Technologies boundary-scan capability on Agilent 3070 in-circuit test (ICT) systemsĬombination of boundary-scan with ICT simplifies test fixtures and increases test coverageĮthernet and PCI interfaces available for universal compatibility with all 3070 UNIX controllers and PC-based Windows systems
#Agilent 3070 ict test systems upgrade
Concurrently, to further protect the investment of existing Agilent Medalist 3070 and i5000 users, the new Medalist i3070 provides a high degree of compatibility with the legacy Agilent ICT systems, making it effortless for end-users to transport across systems with the same configuration.Universal Boundary-Scan Upgrade for Agilent 3070 UNIX- and PC-based In-Circuit Testers
#Agilent 3070 ict test systems software
We have pushed the boundaries on the most flexible and industry-leading in-circuit test platform, and are helping customers improve their time-to-market, reduce their cost and protect their investments." Both the new Medalist i3070 and VTEP v2.0 capabilities can be enabled on existing Medalist ICT systems with a simple software upgrade. "We've also made vast improvements on the throughput and have achieved unprecedented coverage with VTEP v2.0. "The Medalist i3070 enables our customers to develop and debug their programs quicker than before," said NK Chari, ICT marketing manager of Agilent's Measurement Systems Division. Agilent's VTEP v2.0 is the innovative solution to overcome this test limitation. For more information on VTEP v2.0, which is also being introduced today, see Power and ground pins have long been considered off limits to vectorless test because, by design, the power or ground pins are tied together, making an opening in a pin virtually undetectable in any of the currently available vectorless test solutions in the market. The Agilent Medalist i3070 includes another industry first - VTEP v2.0 vectorless test technology that incorporates the new Network Parameter Measurement technology targeted at defect detection on power and ground pins for connectors. Simple graphical user interfaces are designed to maximize ease-of-use for operators in the fast-paced high-volume manufacturing environment. Advanced algorithms provide analog test throughput increase by up to 50 percent compared with legacy Agilent Medalist 3070 systems. For electronics manufacturers around the world, this system is the fastest, easiest way to bring the power of in-circuit test to the production line. (NYSE: A) today announced the availability of the Agilent Medalist i3070 in-circuit test system for printed circuit board assembly.
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